vishay tlmc310. document number 83150 rev. 1.6, 31-aug-04 vishay semiconductors www.vishay.com 1 e3 pb pb-free 19225 low current smd led description these new devices have been designed to meet the increasing demand for low current smd leds. the package of the tlmc310. is the plcc-2 (equiv- alent to a size b tantalum capacitor). it consists of a lead frame which is embedded in a white thermoplast. the reflector inside this package is filled up with clear epoxy. features ? smd led with exceptional brightness compatible with automatic placement equipment eia and ice standard package compatible with infrared, vapor phase and wave solder processes according to cecc available in 8 mm tape low profile package non-diffused lens: excellent for coupling to light pipes and backlighting very low power consumption luminous intensity ratio in one packaging unit i vmax /i vmin 2.0 lead-free device applications automotive: backlighting in dashboards and switches telecommunication: indicator and backlighting in telephone and fax indicator and backlight for audio and video equipment indicator and backlight for battery driven equipment small indicator for outdoor applications indicator and backlight in office equipment flat backlight for lcds, switches and symbols general use parts table absolute maximum ratings t amb = 25 c, unless otherwise specified tlmc310. part color, luminous intensity angle of half intensity ( ? ) technology TLMC3100 green, i v > 0.63 mcd 60 gap on gap tlmc3101 green, i v >1 mcd 60 gap on gap parameter test condition symbol value unit reverse voltage v r 6v dc forward current i f 7ma surge forward current t p 10 si fsm 0.5 a power dissipation t amb 90 c p v 20 mw junction temperature t j 100 c operating temperature range t amb - 40 to + 100 c
www.vishay.com 2 document number 83150 rev. 1.6, 31-aug-04 vishay tlmc310. vishay semiconductors optical and electrical characteristics t amb = 25 c, unless otherwise specified green tlmc310. 2) in one packing unit i vmax /i vmin 2.0 typical characteristics (t amb = 25 c unless otherwise specified) storage temperature range t stg - 55 to + 100 c soldering temperature t 5 s t sd 260 c thermal resistance junction/ ambient mounted on pc board (pad size > 16 mm 2 ) r thja 500 k/w parameter test condition part symbol min ty p. max unit luminous intensity 2) i f = 2 ma TLMC3100 i v 0.63 1.6 mcd tlmc3101 i v 1.0 1.6 mcd dominant wavelength i f = 2 ma d 563 575 nm peak wavelength i f = 2 ma p 565 nm angle of half intensity i f = 2 ma ? 60 deg forward voltage i f = 2 ma v f 1.9 2.4 v reverse voltage i r = 10 av r 615 v junction capacitance v r = 0, f = 1 mhz c j 50 pf parameter test condition symbol value unit figure 1. power dissipation vs. ambient temperature 0 5 10 15 20 25 p - power dissipation ( mw ) v t amb - ambient temperature ( c) 95 10841 100 80 60 40 20 0 figure 2. forward current vs. ambient temperature 0 2 4 6 8 10 i - forward current ( ma ) f 95 10842 100 80 60 40 20 0 t amb - ambient temperature ( c)
vishay tlmc310. document number 83150 rev. 1.6, 31-aug-04 vishay semiconductors www.vishay.com 3 figure 3. rel. luminous intensity vs. angular displacement figure 4. forward current vs. forward voltage figure 5. rel. luminous intensity vs. ambient temperature 0.4 0.2 0 0.2 0.4 0.6 95 10319 0.6 0.9 0.8 0 30 10 20 40 50 60 70 80 0.7 1.0 i - relative luminous intensity vre l 01234 0.1 1 10 100 v f ? forward voltag e(v) 5 95 10056 i ? forward current ( ma) f green t p /t=0.001 t p =10 s 0 0 0.4 0.8 1.2 1.6 95 10057 20 40 60 80 100 i ? relative luminous intensity v rel t amb ? ambient temperature (c ) green i f =2ma figure 6. rel. lumin. intensity vs. forw. current/duty cycle figure 7. relative luminous intensity vs. forward current figure 8. relative intensity vs. wavelength 10 20 50 100 200 0 0.4 0.8 1.2 1.6 2.4 16486 500 v rel 2.0 green i ? specific luminous intensity 1 0.5 0.2 0.1 0.05 0.02 t p /t i f /ma 0.1 1 10 0.01 0.1 1 10 100 100 95 10059 i ? relative luminous intensity v rel i f ? forward current ( ma ) green 520 540 560 580 600 0 0.2 0.4 0.6 0.8 1.2 620 95 10038 - - wavelength ( nm ) 1.0 green i - relative luminous intensity vrel
www.vishay.com 4 document number 83150 rev. 1.6, 31-aug-04 vishay tlmc310. vishay semiconductors package dimensions in mm 95 11314 mounting pad layout 3.5 0.2 0.85 1.65 + 0.10 - 0.05 pin identification 2.8 + 0.15 2.2 ? 2.4 3 + 0.15 1.2 2.6 (2.8) 1.6 (1.9) 4 4 area covered with solder resist dimensions: ir and vaporphase (wave soldering) technical drawings according to din specifications drawing-no. : 6.541-5025.01-4 issue: 7; 05.04.04 ca
vishay tlmc310. document number 83150 rev. 1.6, 31-aug-04 vishay semiconductors www.vishay.com 5 ozone depleting substa nces policy statement it is the policy of vishay semiconductor gmbh to 1. meet all present and future national and international statutory requirements. 2. regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. it is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (odss). the montreal protocol (1987) and its london amendments (1990) intend to severely restrict the use of odss and forbid their use within the next ten years. various national and international initiatives are pressing for an earlier ban on these substances. vishay semiconductor gmbh has been able to use its policy of continuous improvements to eliminate the use of odss listed in the following documents. 1. annex a, b and list of transitional substances of the montreal protocol and the london amendments respectively 2. class i and ii ozone depleting substances in the clean air act amendments of 1990 by the environmental protection agency (epa) in the usa 3. council decision 88/540/eec and 91/690/eec annex a, b and c (transitional substances) respectively. vishay semiconductor gmbh can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. we reserve the right to make changes to improve technical design and may do so without further notice. parameters can vary in different applications. all operating parameters must be validated for each customer application by the customer. should the buyer use vishay semiconductors products for any unintended or unauthorized application, the buyer shall indemnify vishay semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. vishay semiconductor gmbh, p.o.b. 3535, d-74025 heilbronn, germany telephone: 49 (0)7131 67 2831, fax number: 49 (0)7131 67 2423
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